3/6/2024 0 Comments Solder reflow profileControl screen for the selected programĪccept the selected program and move to the control screen.This is important because parts may have be stored for long periods, absorbing the moisture. Set a specific process with lower temperature and longer time period typically for PCB/parts drying tasks. Select the required program and accept it with the tick to edit the preferences Run the profile without looking at the preheat zones defined above.Ĭontrolling the eC-reflow-mate from the display Program selection.The temperature correction is defined for top temperature X ☌.For use of the eC-reflow-mate without the external sensor for soldering this type of PCB, you can compensate this temperature difference by setting the difference value at a temperature (max). Activate and set a temperature correction of X ☌. For your PCB, a difference in temperature registration will exist between the top sensor (furnace) and the external sensor measured at the maximum temperature in the curve.If more power is needed the -40☌ can be reduced to -30☌ or less or even follow (which is 0☌). This way the bottom heater supports the top curve in the best possible way. This means that the bottom heater parameter is set to -40☌. Set the offset with which the bottom needs to follow the top temperature. Generally we define the bottom heater to follow the top IR-lamps curve on a distance of 40☌.This to keep the temperature on the bottom side as low as possible and yet high enough to support the solder process on the top side. Set the bottom temperature. For double sided soldering we suggest that the bottom heater is set to a maximum temperature of 175☌ for lead free soldering and 150☌ for lead soldering.Activating this will open de over door after te hold time of the reflow temperature is over, thus allowing to cool down immediately after soldering. Zone temperature, hold time, active or not.If you click on the save button, you can edit the profile in the profile editing menu.These profiles can also be used as template to specify your own curve. In this window you can see the 9 predefined soldering profiles. We deliver the eC-reflow-pilot software including some predefined solder profiles.Due to the double level built drawer, the PCB will not move as it sits on the top level of the drawer, if the drawer is opened while using the hood. Setting the door open point at 215☌ will make sure that the oven opens up fast enough so cooling can take place quicker. The set dwell time of 10 seconds will exceed 30 seconds, which should be enough for any standard technique. To be sure of the latter, you could still activate T ramp, but that usually has no effect because the oven is slower than the built in security value of not reaching 190☌ within 3 minutes. Due to the enormously good thermal insulated eC-reflow-mate-V4, the effect of the Thermal Inertia, will make sure that heat up times are well under the maximum defined ramp up times. This curve will take the board straight to the reflow temperature and hold it for at least 10 seconds. Since soldering with any chamber reflow oven is very much affected by Thermal Inertia, we recommend to make the curve as simple as possible and to start your reflow experience with a simply 2 point curve: Reflow (245☌, 10 seconds) and Door Open (215☌ with Hood).You can define up to 5 of these points (3 preheat, 1 reflow and 1 doors open point). Since this is very hard to get under control we opted to pilot the oven based on temperature set points and hold times at this specific temperature set point. This time required depends on size of the board, on copper load, solder mask colour, component load and size, etc… some experience will be required to estimate this for your board. therefore our standard lead free curve is set at 245☌ as highest temperature This delta T depends on the size of the board, the copper load of the board, the component load and size on the board etc… For a standard board this delta T will be around 25☌. Therefore the max temperature in the curve should be set at solder temperature of the alloy + a delta T on the board. The dwell temperature of the solder alloy needs to be reached at all solder joints present on the board.To be able to solder using a chamber oven like the eC-reflow-mate it is important to understand that:.
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